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عنوان
Si-RF technology /

پدید آورنده
Ayan Karmakar, Kamaljeet Singh.

موضوع
Radio frequency integrated circuits.,Radio frequency integrated circuits.

رده
TK7874
.
78
.
K37
2019

کتابخانه
Center and Library of Islamic Studies in European Languages

محل استقرار
استان: Qom ـ شهر: Qom

Center and Library of Islamic Studies in European Languages

تماس با کتابخانه : 32910706-025

INTERNATIONAL STANDARD BOOK NUMBER

(Number (ISBN
9789811380518
(Number (ISBN
9789811380525
(Number (ISBN
9789811380532
(Number (ISBN
9811380511
(Number (ISBN
981138052X
(Number (ISBN
9811380538
Erroneous ISBN
9789811380501
Erroneous ISBN
9811380503

TITLE AND STATEMENT OF RESPONSIBILITY

Title Proper
Si-RF technology /
General Material Designation
[Book]
First Statement of Responsibility
Ayan Karmakar, Kamaljeet Singh.

.PUBLICATION, DISTRIBUTION, ETC

Place of Publication, Distribution, etc.
Singapore :
Name of Publisher, Distributor, etc.
Springer,
Date of Publication, Distribution, etc.
[2019]

PHYSICAL DESCRIPTION

Specific Material Designation and Extent of Item
1 online resource (157 pages)

CONTENTS NOTE

Text of Note
Intro; Foreword; Preface; Acknowledgements; Contents; About the Authors; Abbreviations; 1 Silicon Implementation of Planar Topologies; 1.1 Microstrip and CPW Topologies; 1.2 Losses in Planar Topologies; 1.3 Substrate Selection; 1.4 Silicon Substrate and Associated Challenges; 1.5 Modeling Aspects; 1.6 Loss Compensation Techniques; 1.7 Summarization; References; 2 Fabrication Technologies; 2.1 Bulk and Surface Micromachining; 2.2 Wafer Bonding; 2.2.1 Anodic Bonding; 2.2.2 Eutectic Bonding; 2.3 Summarization; References; 3 Passive Circuits; 3.1 Planar Balun (Single-Band Topology)
Text of Note
3.1.1 Design Aspects3.1.2 Electromagnetic Analysis and Layout; 3.1.3 Effect of Substrate Resistivity; 3.1.4 Fabrication and Measured Results; 3.2 Power Divider (Multiband Topologies); 3.2.1 Dual-Band Power Divider; 3.2.2 Receiver Concept (Multiband Topology); 3.3 CPW-Microstrip Transition; 3.4 Summarization; References; 4 Planar Antenna; 4.1 Ultra-Wideband Topology; 4.1.1 Antenna Design; 4.1.2 Fabrication and Measured Results; 4.1.3 Time-Domain Analysis of the Proposed Monopole Antenna; 4.2 Micromachined Patch Antenna and Array Topology; 4.2.1 Antenna Design
Text of Note
4.2.2 Fabrication and Measured Results4.3 Summary; 4.4 MATLAB Program for Calculations of Patch Length and Width with Given Dimensions; References; 5 MEMS Switch; 5.1 Background; 5.2 RF-Switch Development; 5.2.1 Electrical Modeling; 5.2.2 Fabrication Process; 5.2.3 Test and Characterization; 5.3 Switched-Line Phase Shifter; 5.3.1 Bit Design; 5.3.2 CLR Model of Single-Bit Phase Shifter; 5.3.3 EM Simulation of the Individual Bit; 5.3.4 Fabricated Prototype; 5.3.5 Proposed Testing Methodology of Phase Shifter; 5.4 MATLAB Program; 5.5 Summary; References; 6 Packaging Concept in Radio Frequency
Text of Note
6.1 Standard RF Package Configuration6.2 Package Simulation; 6.2.1 Eigen-Mode Simulation; 6.2.2 Loss Characterization; 6.3 Proposed Modification; 6.4 Characterization; 6.5 Through-Silicon Via (TSV); 6.5.1 Modeling; 6.5.2 Process Establishment; 6.6 MATLAB Code; 6.7 Summary; References; Future Scope; Appendix A; Material Properties of Some Useful Metals and Dielectrics; Appendix B; Relaxation Time Estimation for Some Materials Used in RF/Microwave Applications; Appendix C; Tentative Etch Rate of Various Thin Films of in Wet and Dry Methods; Appendix D
Text of Note
Readymade Chart for VSWR, Return Loss, and Reflection CoefficientAppendix E; Frequently used Equipments and Test Components in RF Domain
0
8
8
8
8

SUMMARY OR ABSTRACT

Text of Note
This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.

ACQUISITION INFORMATION NOTE

Source for Acquisition/Subscription Address
Springer Nature
Stock Number
com.springer.onix.9789811380518

OTHER EDITION IN ANOTHER MEDIUM

Title
Si-RF Technology.
International Standard Book Number
9789811380501

PARALLEL TITLE PROPER

Parallel Title
Silicon radio frequency technology

TOPICAL NAME USED AS SUBJECT

Radio frequency integrated circuits.
Radio frequency integrated circuits.

(SUBJECT CATEGORY (Provisional

TEC024000
TJFN
TJFN

DEWEY DECIMAL CLASSIFICATION

Number
621
.
38412
Number
621
.
39/5
Edition
23
Edition
23

LIBRARY OF CONGRESS CLASSIFICATION

Class number
TK7874
.
78
Book number
.
K37
2019

PERSONAL NAME - PRIMARY RESPONSIBILITY

Karmakar, Ayan

PERSONAL NAME - ALTERNATIVE RESPONSIBILITY

Singh, Kamaljeet

ORIGINATING SOURCE

Date of Transaction
20200823231036.0
Cataloguing Rules (Descriptive Conventions))
pn

ELECTRONIC LOCATION AND ACCESS

Electronic name
 مطالعه متن کتاب 

[Book]

Y

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