عنوان

Wide Bandgap Power Semiconductor Packaging :

(Number (ISBN

0081020953

(Number (ISBN

9780081020951

Erroneous ISBN

0081020945

Erroneous ISBN

9780081020944

Title Proper

Wide Bandgap Power Semiconductor Packaging :

General Material Designation

[Book]

Other Title Information

Materials, Components, and Reliability /

First Statement of Responsibility

edited by Katsuaki Suganuma.

Place of Publication, Distribution, etc.

Duxford, United Kingdom :

Name of Publisher, Distributor, etc.

Woodhead Publishing is an imprint of Elsevier,

Date of Publication, Distribution, etc.

[2018]

Date of Publication, Distribution, etc.

©2018

Specific Material Designation and Extent of Item

1 online resource.

Series Title

Woodhead Publishing series in electronic and optical materials

Text of Note

Includes bibliographical references and index.

Text of Note

"Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates"--

Source for Acquisition/Subscription Address

Ingram Content Group

Stock Number

9780081020951

International Standard Book Number

9780081020944

Microelectronic packaging.

Wide gap semiconductors.

Microelectronic packaging.

TECHNOLOGY & ENGINEERING / Mechanical.

Wide gap semiconductors.

TEC-- 009070

Number

Edition

Class number

Suganuma, Katsuaki

Date of Transaction

20200822084622.0

Cataloguing Rules (Descriptive Conventions))

pn

Electronic name

[Book]

Y