design and engineering of electronics systems based on new computing paradigms : 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8-10, 2018, Revised and extended selected papers /
IFIP advances in information and communication technology ;
Volume Designation
561
GENERAL NOTES
Text of Note
Includes author index.
SUMMARY OR ABSTRACT
Text of Note
This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018. The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
ACQUISITION INFORMATION NOTE
Source for Acquisition/Subscription Address
Springer Nature
Stock Number
com.springer.onix.9783030234256
PARALLEL TITLE PROPER
Parallel Title
VLSI-SoC 2018
TOPICAL NAME USED AS SUBJECT
Computer network architectures, Congresses.
Integrated circuits-- Very large scale integration, Congresses.
Internet of things, Congresses.
Systems on a chip, Congresses.
Computer network architectures.
Integrated circuits-- Very large scale integration.
Internet of things.
Systems on a chip.
DEWEY DECIMAL CLASSIFICATION
Number
004
.
6
Edition
23
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK7874
.
75
Book number
.
I34
2018
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
Austin, Todd
Bombieri, Nicola
Fujita, Masahiro
Pravadelli, Graziano
Reis, Ricardo A. L., (Ricardo Augusto da Luz)
CORPORATE BODY NAME - PRIMARY RESPONSIBILITY
IEEE/IFIP International Conference on VLSI and System-on-Chip(26th :2018 :, Verona, Italy)