Lithography -- Pattern transfer with dry etching techniques -- Pattern transfer with additive techniques -- Wet bulk micromachining -- Surface micromachining -- LIGA and micromolding -- A comparison of miniaturization techniques : top-down and bottom-up manufacturing -- Modeling, brains, packaging, sample preparation, and substrate choice -- Scaling, actuators, and power in miniaturized systems -- Miniaturization applications -- Appendix A: Metrology techniques for MEMS -- Appendix B: Living book -- Appendix C: Si and SiO₂ etch rates in KOH -- Appendix D: Genetics -- Appendix E: Suggested further reading -- Appendix F: MEMS companies -- Appendix G: Glossary.
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TOPICAL NAME USED AS SUBJECT
Integrated circuits-- Design and construction.
Lasers-- Industrial applications.
Machining.
Microelectromechanical systems-- Design and construction.
Microelectronic packaging.
Microelectronics.
Circuits intégrés-- Conception et construction
Lasers-- Applications industrielles
Microélectronique
Mise sous boîtier (Microélectronique)
Usinage
Circuit intégré
Encapsulamento eletrônico.
Fertigungstechnik
Integrated circuits-- Design and construction.
Laser (aplicações industriais)
Lasers-- Industrial applications.
LASERS.
Lithografie
Machining.
MACHINING.
Microelectromechanical systems-- Design and construction.