NOTES PERTAINING TO PUBLICATION, DISTRIBUTION, ETC.
Text of Note
Place of publication: United States, Ann Arbor; ISBN=978-1-369-04368-6
DISSERTATION (THESIS) NOTE
Dissertation or thesis details and type of degree
M.S.
Discipline of degree
Electrical and Computer Engineering
Body granting the degree
University of Idaho
Text preceding or following the note
2016
SUMMARY OR ABSTRACT
Text of Note
High speed, high densities and system-in-packages play an important role in microelectronics. Taking advantage of process technology improvements, semiconductor vendors are increasing device densities which increases demand on total current delivery. In this case, electrical integrity which includes signal integrity, power integrity and electromagnetic interference, is a major issue. Signal integrity assures acceptable quality of signals within the system, such as transmission line effects, cross talk, impedance mismatch. Power integrity assures acceptable quality of power delivery within the system, such as voltage drop, high impedance, parasitic via inductances, noise coupling are the most significant challenges for a semiconductor device designer. The increasingly rigorous noise requirements and timing issues require more predictive signal integrity and power integrity analysis to meet the market demand.
TOPICAL NAME USED AS SUBJECT
Electrical engineering
UNCONTROLLED SUBJECT TERMS
Subject Term
Applied sciences;Ansys HFSS;Differential S parameters;Power distribution network (PDN);Power integrity;Signal integrity;Z parameters