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عنوان
Advanced MEMS packaging
پدید آورنده
John H. Lau [and others].
موضوع
Microelectromechanical systems.,Microelectronic packaging.,TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
رده
TK7875
.
J646
2010
کتابخانه
Center and Library of Islamic Studies in European Languages
محل استقرار
استان:
Qom
ـ شهر:
Qom
تماس با کتابخانه :
32910706
-
025
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
0071626239
(Number (ISBN
0071627928
(Number (ISBN
0071741836
(Number (ISBN
1615831592
(Number (ISBN
9780071626231
(Number (ISBN
9780071627924
(Number (ISBN
9780071741835
(Number (ISBN
9781615831593
NATIONAL BIBLIOGRAPHY NUMBER
Number
b620342
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Advanced MEMS packaging
General Material Designation
[Book]
First Statement of Responsibility
John H. Lau [and others].
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
McGraw-Hill
Date of Publication, Distribution, etc.
©2010.
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
(xxiii, 552 pages) : illustrations
SERIES
Series Title
McGraw-Hill's AccessEngineering
CONTENTS NOTE
Text of Note
Introduction to MEMS --; Advanced MEMS packaging --; Enabling technologies for advanced MEMS packaging --; Advanced MEMS wafer-level packaging --; Optical MEMS packaging : communications --; Optical MEMS packaging : bubble switch --; Optical MEMS : microbolometer packaging --; Bio-MEMS packaging --; Biosensor packaging --; Accelerometer packaging --; Radiofrequency MEMS switches --; RF MEMS tunable capacitors and tubable band-pass filters --; Advanced packaging of RF MEMS devices.
SUMMARY OR ABSTRACT
Text of Note
Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices. --
PARALLEL TITLE PROPER
Parallel Title
Advanced microelectromechanical systems packaging
TOPICAL NAME USED AS SUBJECT
Microelectromechanical systems.
Microelectronic packaging.
TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK7875
Book number
.
J646
2010
PERSONAL NAME - PRIMARY RESPONSIBILITY
John H. Lau [and others].
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
John H Lau
ELECTRONIC LOCATION AND ACCESS
Electronic name
مطالعه متن کتاب
[Book]
Y
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