Handbook Of Electronics Packaging Design and Engineering
General Material Designation
[Book]
First Statement of Responsibility
by Bernard S. Matisoff.
EDITION STATEMENT
Edition Statement
Second edition
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Dordrecht
Name of Publisher, Distributor, etc.
Springer Netherlands
Date of Publication, Distribution, etc.
1990
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
(volumes)
CONTENTS NOTE
Text of Note
1 Electronics Packaging Design and Engineering --;2 Project Planning --;3 Human Factors Engineering --;4 Fabrication Processes --;5 Mechanical Fasteners --;6 Heat Transfer and Thermal Control --;7 Shock and Vibration Design --;8 Subassemblies and Assemblies --;9 Design Considerations for Space Electronics --;10 Material Plating and Finishes --;11 Radio Frequency and Electromagnetic Shielding --;12 Design and Development of Miniature Electronics Systems --;13 Wire and Cabling --;14 Materials and Processes --;15 Safety --;16 Printed Circuits --;17 Electrical Interconnection Systems --;18 Forced Air Cooling Systems --;19 Preferred Materials for Electronic Packaging --;20 Selection of Plastics for Various Environments --;21 Mechanics of Simple Stresses --;22 Formulas and Conversions --;23 Design Reviews --;An Instrument for Decision Making --;24 Slide Mount Considerations for Electronic Assemblies --;25 Reference Designations for Electrical and Electronic Parts and Equipment --;26 Metal Alloy and Temper Designation Systems --;Appendix A --;Appendix B.
SUMMARY OR ABSTRACT
Text of Note
The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design of electronics equip- ment. The judicious use of uniform design practices will realize the following economies and equipment improvements: * Economics of design.