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عنوان
Handbook of physical vapor deposition (PVD) processing :

پدید آورنده
by Donald M. Mattox.

موضوع
Physical vapor deposition -- Handbooks, manuals, etc.,Physical vapor deposition.,TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades.

رده

کتابخانه
Center and Library of Islamic Studies in European Languages

محل استقرار
استان: Qom ـ شهر: Qom

Center and Library of Islamic Studies in European Languages

تماس با کتابخانه : 32910706-025

INTERNATIONAL STANDARD BOOK NUMBER

(Number (ISBN
0815517610
(Number (ISBN
9780815517610

NATIONAL BIBLIOGRAPHY NUMBER

Number
b536884

TITLE AND STATEMENT OF RESPONSIBILITY

Title Proper
Handbook of physical vapor deposition (PVD) processing :
General Material Designation
[Book]
Other Title Information
film formation, adhesion, surface preparation and contamination control
First Statement of Responsibility
by Donald M. Mattox.

.PUBLICATION, DISTRIBUTION, ETC

Place of Publication, Distribution, etc.
Westwood, N.J.
Name of Publisher, Distributor, etc.
Noyes Publications
Date of Publication, Distribution, etc.
©1998.

PHYSICAL DESCRIPTION

Specific Material Designation and Extent of Item
(xxvii, 945 pages) : illustrations

CONTENTS NOTE

Text of Note
Preface"; "Contributors"; "Table of Contents"; "1 INTRODUCTION"; "2 SILICIDES AND CONTACTS FOR ULSI"; "3 ALUMINUM BASED MULTILEVEL METALLIZATIONS IN VLSI/ULSICs"; "4 INORGANIC DIELECTRICS"; "5 ORGANIC DIELECTRICS IN MULTILEVEL METALLIZATION OF INTEGRATED CIRCUITS"; "6 PLANARIZATION TECHNIQUES"; "7 LITHOGRAPHY AND ETCH ISSUES FOR A MULTILEVEL METALLIZATION SYSTEM"; "8 ELECTRO- AND STRESS MIGRATION IN MLM INTERCONNECT STRUCTURES"; "9 MULTILEVEL METALLIZATION TEST VEHICLE"; "10 MANUFACTURING AND ANALYTIC METHODS" "11 characterization techniques for vlsi multilevel metallization""12 electronic packaging and its influences on integrated circuit design and processing"; "13 future interconnect systems"; "index"

SUMMARY OR ABSTRACT

Text of Note
Covers various aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. This book also covers substrate characterization, adhesion, cleaning and processing.

TOPICAL NAME USED AS SUBJECT

Physical vapor deposition -- Handbooks, manuals, etc.
Physical vapor deposition.
TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades.

PERSONAL NAME - PRIMARY RESPONSIBILITY

by Donald M. Mattox.

PERSONAL NAME - ALTERNATIVE RESPONSIBILITY

D M Mattox

ELECTRONIC LOCATION AND ACCESS

Electronic name
 مطالعه متن کتاب 

[Book]

Y

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