fundamentals, etching, deposition, and surface interactions /
First Statement of Responsibility
edited by Stephen M. Rossnagel, Jerome J. Cuomo, William D. Westwood.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Park Ridge, N.J. :
Name of Publisher, Distributor, etc.
Noyes Publications,
Date of Publication, Distribution, etc.
c1990.
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
1 online resource (xxiii, 523 p.) :
Other Physical Details
ill.
SERIES
Series Title
Materials science and process technology series.
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index.
SUMMARY OR ABSTRACT
Text of Note
An overview of the technology that describes the advantages provided by plasmas, plasma fundamentals, and a range of plasma processes relevant to the deposition and etching of thin films for microelectronics and other fields.