edited by Mikhail R. Baklanov, Paul S. Ho and Ehrenfried Zschech
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xxvi, 579 pages :
Other Physical Details
illustrations (some color),
Dimensions
26 cm
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index
SUMMARY OR ABSTRACT
Text of Note
"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--
TOPICAL NAME USED AS SUBJECT
Integrated circuits-- Ultra large scale integration