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عنوان
Silicon wafer bonding technology :
پدید آورنده
edited by Subramanian S. Iyer and Andre J. Auberton-Hervé
موضوع
Integrated circuits-- Very large scale integration,Microelectromechanical systems,Silicon-on-insulator technology
رده
کتابخانه
Center and Library of Islamic Studies in European Languages
محل استقرار
استان:
Qom
ـ شهر:
Qom
تماس با کتابخانه :
32910706
-
025
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
0852960395
NATIONAL BIBLIOGRAPHY NUMBER
Number
dltt
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Silicon wafer bonding technology :
General Material Designation
[Book]
Other Title Information
for VLSI and MEMS applications /
First Statement of Responsibility
edited by Subramanian S. Iyer and Andre J. Auberton-Hervé
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
London :
Name of Publisher, Distributor, etc.
Institution of Electrical Engineers,
Date of Publication, Distribution, etc.
c2002
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xxv, 149 p. :
Other Physical Details
ill. ;
Dimensions
26 cm
SERIES
Series Title
EMIS processing series ;
ISSN of Series
no. 1
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index
TOPICAL NAME USED AS SUBJECT
Integrated circuits-- Very large scale integration
Microelectromechanical systems
Silicon-on-insulator technology
DEWEY DECIMAL CLASSIFICATION
Number
621
.
38152
Edition
21
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
Auberton-Hervé, Andre J
Iyer, Subramanian S
CORPORATE BODY NAME - ALTERNATIVE RESPONSIBILITY
INSPEC., EMIS Group
Institution of Electrical Engineers
ORIGINATING SOURCE
Date of Transaction
20030630095434.0
ELECTRONIC LOCATION AND ACCESS
Electronic name
مطالعه متن کتاب
[Book]
Y
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