عنوان
پدید آورنده
موضوع
رده
کتابخانه
محل استقرار
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
9781441948731
(Number (ISBN
9781475731590
NATIONAL BIBLIOGRAPHY NUMBER
Number
dltt
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
General Material Designation
[Book]
First Statement of Responsibility
edited by G. Q. Zhang, L. J. Ernst, O. Saint Leger.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Boston, MA :
Name of Publisher, Distributor, etc.
Imprint: Springer,
Date of Publication, Distribution, etc.
2000.
SUMMARY OR ABSTRACT
Text of Note
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:-
OTHER EDITION IN ANOTHER MEDIUM
International Standard Book Number
9781441948731
PIECE
Title
Springer eBooks
TOPICAL NAME USED AS SUBJECT
Computer engineering.
Engineering.
Machinery.
Mechanics.
Optical materials.
Systems theory.
PERSONAL NAME - PRIMARY RESPONSIBILITY
Zhang, G. Q.
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
Ernst, L. J.
Saint Leger, O.
CORPORATE BODY NAME - ALTERNATIVE RESPONSIBILITY
SpringerLink (Online service)
ORIGINATING SOURCE
Date of Transaction
20190301074600.0
ELECTRONIC LOCATION AND ACCESS
Electronic name
مطالعه متن کتاب [Book]
Y
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