عنوان
پدید آورنده
موضوع
رده
کتابخانه
محل استقرار
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
0470827807
(Number (ISBN
9780470827802
NATIONAL BIBLIOGRAPHY NUMBER
Number
dltt
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Modeling and simulation for microelectronic packaging assembly
General Material Designation
[Book]
Other Title Information
manufacturing, reliability, and testing /
First Statement of Responsibility
Sheng Liu, Yong Liu.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Singapore :
Name of Publisher, Distributor, etc.
Wiley,
Date of Publication, Distribution, etc.
2011.
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index.
SUMMARY OR ABSTRACT
Text of Note
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
TOPICAL NAME USED AS SUBJECT
Microelectronic packaging-- Simulation methods.
OTHER CLASS NUMBERS
Class number
TEC008010
System Code
bisacsh
PERSONAL NAME - PRIMARY RESPONSIBILITY
Liu, S., (Sheng),1963-
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
Liu, Yong, (Micro-optoelectronic mechanical systems professor)
CORPORATE BODY NAME - ALTERNATIVE RESPONSIBILITY
Wiley Online Library (Online service)
ORIGINATING SOURCE
Date of Transaction
20190423142947.0
ELECTRONIC LOCATION AND ACCESS
Electronic name
مطالعه متن کتاب [Book]
Y
