عنوان

Polymeric materials for electronics packaging and interconnection :

(Number (ISBN

0841216797

(Number (ISBN

9780841216792

Number

b428552

Title Proper

Polymeric materials for electronics packaging and interconnection :

General Material Designation

[Book]

Other Title Information

developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988 /

First Statement of Responsibility

John H. Lupinski, editor, Robert S. Moore, editor.

Place of Publication, Distribution, etc.

Washington, DC :

Name of Publisher, Distributor, etc.

American Chemical Society,

Date of Publication, Distribution, etc.

1989.

Specific Material Designation and Extent of Item

xi, 499 pages :

Other Physical Details

illustrations ;

Dimensions

24 cm.

Series Title

ACS symposium series ;

Volume Designation

407

Text of Note

Includes bibliographical references and indexes.

Text of Note

Polymeric materials for electronics packaging and interconnection : an overview / John H. Lupinski and Robert S. Moore -- Cure studies of PMDA-ODA- and BTDA-ODA-based polyimides by fluorescence spectroscopy / Eric D. Wachsman, Peter S. Martin, and Curtis W. Frank -- Dynamic Fourier transform-IR analysis of cure reactions and kinetics of polyimides / Randy W. Snyder and Paul C. Painter -- Polyimide hydrolysis : measurement by Fourier transform-IR spectroscopy / Coralie A. Pryde -- Dielectric characterization of water in polyimide and poly(amide-imide) thin films / Allyson J. Beuhler, Neal R. Nowicki, and Joanne M. Gaudette -- Calculated final-state effects of the PMDA-ODA polyimide X-ray photoemission spectrum / A.R. Rossi and B.D. Silverman -- Effect of diamic acid additives on dielectric constants of polyimides / Diane M. Stoakley and Anne K. St. Clair -- Organic dielectric materials with reduced moisture absorption and improved electrical properties / D.L. Goff, E.L. Yuan, H. Long, and Herbert J. Neuhaus -- Synthesis and characterization of the t-butyl ester of the oxydianiline-pyromellitic dianhydride polyamic acid / F.M. Houlihan, B.J. Bachman, C.W. Wilkins, Jr., and Coralie A. Pryde -- Curing of binary mixtures of polyimides / C. Feger -- Polyimides for dielectric layers / L.M. Baker, P.J. Brown, and J.L. Markham -- Siloxane polyimides for interlayer dielectric applications / P.P. Policastro, John H. Lupinski, and P.K. Hernandez -- Electrophoretic deposition of polyimides : electrocoating on the cathode / Stephen L. Buchwalter -- Accelerated testing of polyimide coatings for neural prostheses / J. McHardy, D.I. Basiulis, G. Angsten, L.R. Higley, and R.N. Leyden -- Conduction transients in polyimides / Herbert J. Neuhaus and Stephen D. Senturia -- Polymer insulating layers for multilayer hybrid circuits / L.M. Baker, J.L. Markham, and R.D. Small -- Fabrication and properties of thermoset films derived from bis-benzocyclobutene for multilayer applications / S.F. Hahn, P.H. Townsend, D.C. Burdeaux, and J.A. Gilpin -- Synthesis of poly(arylene ether phenylquinoxaline) / James L. Hedrick and Jeff W. Labadie -- High-performance silicone gel as integrated-circuit-device chip protection : cure study and electrical reliability / C.P. Wong -- Silicone gels for semiconductor applications : chemistry and properties / Gust J. Kookootsedes -- Advantages of silicone gel for packaging of devices with very large scale integration (VLSI) / Kanji Otsuka, Hisashi Ishida, Yasuyuki Utsumi, Takashi Miwa, and Yuji Shirai -- Modeling of triple-track and comb-pattern leakage current measurements / Philip R. Troyk, David Conroy, and James E. Anderson -- Silicone gels and coatings for integrated-circuit packaging / Justin C. Bolger -- Ultraviolet-curable silicones for integrated-circuit protection / Michael A. Lutz and Kristen A. Scheibert -- Moisture transport phenomena in epoxies for microelectronics applications / D.J. Belton, E.A. Sullivan, and M.J. Molter -- Heterogeneous conduction processes in integrated-circuit encapsulation / D.A. Hoffmann, James E. Anderson, L.J. Bousse, and Curtis W. Frank -- Novel coatings that maintain low surface-water concentrations / James E. Anderson, V. Markovac, I. Kim, and Philip R. Troyk -- Thermal stress in epoxy molding compounds and packaged devices / W.F. van den Bogert, M.J. Molter, S.A. Gee, D.J. Belton, and V.R. Akylas -- Characterization of stresses in polymer films for microelectronics applications / Rolf W. Biernath and David S. Soane -- Stress factors in molding compounds / A.A. Gallo -- New transfer molding compounds / E.W. Walles, John H. Lupinski, S. Bandes, and M. Rosenfield -- Chemistry of stable brominated epoxies / C.S. Wang, D.B. Fritz, and A. Mendoza -- Performance of stable brominated epoxies in encapsulants for microelectronic devices / D.B. Fritz and C.S. Wang -- New polymeric materials for electronics packaging / H. Hacker, K.-R. Hauschildt, J. Huber, H. Laupenmühlen, and D. Wilhelm -- Degradation of brominated epoxy resin and effects on integrated-circuit-device wirebonds / M. Nakao, T. Nishioka, M. Shimizu, H. Tabata, and K. Ito -- Enhancement of gold-aluminum wirebond reliability in plastic encapsulated very large scale integration (VLSI) devices through C-Br bond stabilization / Muhib M. Khan, Homi Fatemi, Jeremias Romero, and Eugene Delenia -- Ordered polymers for interconnection substrates / Richard Lusignea, Joseph Piche, and Richard Mathisen -- Three-dimensional circuit interconnections with thermoplastic performance polymers / David C. Frisch and John F. Rowe -- Significance of developments in new substrate materials / Edward Donnelly.

0

Title

Polymeric materials for electronics packaging and interconnection.

Electronic packaging-- Materials, Congresses.

Polymers, Congresses.

X600

Class number

Book number

Lupinski, John H.,1927-

Moore, Robert S.,1933-

American Chemical Society., Division of Polymer Chemistry.

American Chemical Society., Division of Polymeric Materials: Science and Engineering.

American Chemical Society., Meeting(196th :1988 :, Los Angeles, Calif.)

Date of Transaction

20140211095335.0

Electronic name

[Book]

Y