عنوان

Polymer materials for electronic applications :

(Number (ISBN

0841207151

(Number (ISBN

9780841207158

Number

b428352

Title Proper

Polymer materials for electronic applications :

General Material Designation

[Book]

Other Title Information

based on a symposium sponsored by the Division of Organic Coatings and Plastics Chemistry at the second chemical congress of the North American continent (180th ACS national meeting), Las Vegas, Nevada, August 26-27, 1980 /

First Statement of Responsibility

Eugene D. Feit, editor, Cletus W. Wilkins, Jr., editor.

Place of Publication, Distribution, etc.

Washington, D.C. :

Name of Publisher, Distributor, etc.

American Chemical Society,

Date of Publication, Distribution, etc.

1982.

Specific Material Designation and Extent of Item

x, 256 pages :

Other Physical Details

illustrations ;

Dimensions

24 cm.

Series Title

ACS symposium series,

Volume Designation

184

ISSN of Series

0097-6156 ;

Text of Note

Includes bibliographical references and index.

Text of Note

A sensitive positive-working cross-linked methacrylate electron resist / E.D. Roberts -- Radiation degradation and film solubility rates of poly(butene-1-sulfone) / Larry Stillwagon -- Poly(methyl methacrylate-co-3-oximino-2-butanone methacrylate-co-methacrylonitrile) : a deep-UV photoresist / E. Reichmanis and C.W. Wilkins, Jr. -- Compositional analysis of a terpolymer photoresist by raman spectroscopy / F.J. Purcell, E. Russavage, E. Reichmanis, and C.W. Wilkins, Jr. -- Effect of composition on resist dry-etching susceptibility : vinyl polymers and photoresists / J.N. Helbert and M.A. Schmidt -- Poly(N-alkyl-o-nitroamides) : a new class of thermally stable, photosensitive polymers / S.A. MacDonald and C.G. Willson -- A new approach to high-resolution lithography based on conducting organic charge transfer salts / E.M. Engler, Y. Tomkiewicz, J.D. Kuptsis, R.G. Schad, V.V. Patel, and M. Hatzakis -- Polyimide for multilevel very large-scale integration (VLSI) / Gay Samuelson -- Polyimide coatings for microelectronic applications / Y.K. Lee and J.D. Craig -- Development of polyimide isoindoloquinazolinedione in multilevel interconnections for large-scale integration (LSI) / Atsushi Saiki, Kiichiro Mukai, Seiki Harada, and Yasuo Miyadera -- Characterizing polyimide films for semiconductor application / A.M. Wilson, D. Laks, and S.M. Davis -- Implications of electronic and ionic conductivities of polyimide films in integrated circuit fabrication / George A. Brown -- Improved room-temperature vulcanized (RTV) silicone elastomers as integrated circuit (IC) encapsulants / Ching-Ping Wong -- Synthesis and properties of branched epoxy resins / Jon F. Geibel -- Characterization of cured epoxy powder coatings by solvent absorption / W.A. Romanchick and J.F. Geibel -- Thermal degradation of polymers for molded integrated circuit (IC) devices : the effect of a flame retardant / R.M. Lum and L.G. Feinstein -- Electrical switching and memory phenomena in semiconducting organic thin films / R.S. Potember and T.O. Poehler.

0

Electronics-- Materials, Congresses.

Polymers, Congresses.

Class number

Book number

Feit, Eugene D.,1935-

Wilkins, Cletus W.,1945-

American Chemical Society., Division of Organic Coatings and Plastics Chemistry.

American Chemical Society., Meeting(180th :1980 :, Las Vegas, Nev.)

Chemical Congress of the North American Continent(2nd :1980 :, Las Vegas, Nev.)

Date of Transaction

20140122041600.0

Electronic name

[Book]

Y