عنوان

Reliability and failure of electronic materials and devices /

(Number (ISBN

0080575528

(Number (ISBN

9780080575520

Erroneous ISBN

0120885743

Erroneous ISBN

9780120885749

Number

b409942

Title Proper

Reliability and failure of electronic materials and devices /

General Material Designation

[Book]

First Statement of Responsibility

Milton Ohring, Lucian Kasprzak

Edition Statement

Second edition

Specific Material Designation and Extent of Item

1 online resource

Text of Note

Includes index

Text of Note

Machine generated contents note: CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues

Text of Note

Includes bibliographical references and index

Text of Note

FrontCover; FM-CTR-01; DEDICATION; CONTENTS; Chapter 11 -- Characterization and Failure Analysis of Materials and Devices; PREFACE TO THE FIRST EDITION; 1.1 ELECTRONIC PRODUCTS; 1.3 FAILURE PHYSICS; 1.4 SUMMARY AND PERSPECTIVE; REFERENCES; 2.7 GAAS DEVICES; 2.8 ELECTRO-OPTICAL DEVICES; 2.9 PROCESSING-THE CHIP LEVEL; 2.10 MICROELECTROMECHANICAL SYSTEMS; EXERCISES; REFERENCES; 4.8 EPILOGUE-FINAL COMMENT; EXERCISES; REFERENCES; 5.2 DIFFUSION AND ATOM MOVEMENTS IN SOLIDS; 6.2 ASPECTS OF CONDUCTION IN INSULATORS; 7.2 ATMOSPHERIC CONTAMINATION AND MOISTURE; 8.5 THERMAL STRESSES IN PACKAGE STRUCTURES

Text of Note

9.2 the nature of contacts11.2 nondestructive examination and decapsulation; 12.2 integrated circuit technology trends; acronyms

0

8

Text of Note

"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"--

Source for Acquisition/Subscription Address

Safari Books Online

Stock Number

CL0500000508

Title

Reliability and failure of electronic materials and devices.

International Standard Book Number

9780120885749

Electronic apparatus and appliances-- Reliability

System failures (Engineering)

Class number

Book number

Ohring, Milton,1936-

Kasprzak, Lucian

Date of Transaction

20190223072722.2

Cataloguing Rules (Descriptive Conventions))

pn

Electronic name

[Book]

Y