عنوان
پدید آورنده
موضوع
رده
کتابخانه
محل استقرار
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
9783642061158
(Number (ISBN
9783662079287
NATIONAL BIBLIOGRAPHY NUMBER
Number
b406981
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
General Material Designation
[Book]
Other Title Information
From Particle Scale to Feature, Die and Wafer Scales /
First Statement of Responsibility
by Jianfeng Luo, David A. Dornfeld.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Berlin, Heidelberg :
Name of Publisher, Distributor, etc.
Imprint: Springer,
Date of Publication, Distribution, etc.
2004.
CONTENTS NOTE
Text of Note
Introduction -- Review of CMP Modeling -- Material Removal Mechanism in CMP -- Effects of Abrasive Size Distribution in CMP -- Material Removal Regions in CMP -- One and Semi-Two Dimensional Feature- and Die-Scale Modeling for the Damascene Process -- Three-Dimensional Feature-Scale Modeling of CMP -- Wafer-Scale Modeling of CMP -- Summary and Future work.
0
SUMMARY OR ABSTRACT
Text of Note
This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP.
OTHER EDITION IN ANOTHER MEDIUM
International Standard Book Number
9783642061158
PIECE
Title
Springer eBooks
TOPICAL NAME USED AS SUBJECT
Chemistry, Physical organic.
Electronics.
Engineering.
Optical materials.
Surfaces (Physics).
PERSONAL NAME - PRIMARY RESPONSIBILITY
Luo, Jianfeng.
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
Dornfeld, D. A.
CORPORATE BODY NAME - ALTERNATIVE RESPONSIBILITY
SpringerLink (Online service)
ORIGINATING SOURCE
Date of Transaction
20190301083800.0
ELECTRONIC LOCATION AND ACCESS
Electronic name
مطالعه متن کتاب [Book]
Y
