عنوان
پدید آورنده
موضوع
رده
کتابخانه
محل استقرار
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
9781461376590
(Number (ISBN
9781461558033
NATIONAL BIBLIOGRAPHY NUMBER
Number
b403413
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Manufacturing Challenges in Electronic Packaging
General Material Designation
[Book]
First Statement of Responsibility
by Y. C. Lee, W. T. Chen.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Boston, MA :
Name of Publisher, Distributor, etc.
Imprint: Springer,
Date of Publication, Distribution, etc.
1998.
SUMMARY OR ABSTRACT
Text of Note
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
OTHER EDITION IN ANOTHER MEDIUM
International Standard Book Number
9781461376590
PIECE
Title
Springer eBooks
TOPICAL NAME USED AS SUBJECT
Engineering.
Machinery.
PERSONAL NAME - PRIMARY RESPONSIBILITY
Lee, Y. C.
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
Chen, W. T.
CORPORATE BODY NAME - ALTERNATIVE RESPONSIBILITY
SpringerLink (Online service)
ORIGINATING SOURCE
Date of Transaction
20190307155200.0
ELECTRONIC LOCATION AND ACCESS
Electronic name
مطالعه متن کتاب [Book]
Y
