عنوان
پدید آورنده
موضوع
رده
کتابخانه
محل استقرار
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
9781461373742
(Number (ISBN
9781461552116
NATIONAL BIBLIOGRAPHY NUMBER
Number
b403347
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
General Material Designation
[Book]
First Statement of Responsibility
by Y. Sungtaek Ju, Kenneth E. Goodson.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Boston, MA :
Name of Publisher, Distributor, etc.
Imprint: Springer,
Date of Publication, Distribution, etc.
1999.
SERIES
Series Title
Microsystems,
Volume Designation
6
ISSN of Series
1389-2134 ;
SUMMARY OR ABSTRACT
Text of Note
The study of thermal phenomena in microdevices has attracted significant attention recently. The interdisciplinary nature of this topic, however, makes it very difficult for researchers to fully understand details of research results presented in journal articles. For many researchers intending to be active in this field, therefore, a more comprehensive treatment, complete with sufficient background information, is urgently needed. Advances in semiconductor device technology render the thermal characterization and design of ICs increasingly more important. The present book discusses experimental and theoretical studies of heat transfer in transistors and interconnects. A novel optical thermometry technique captures temperature fields with high temporal and spatial failures in devices that are subjected to electrical overstress (EOS) and electrostatic discharge (ESD). Also reported are techniques for determining the thermal transport properties of dielectric passivation layers and ultra-thin silicon-on-insulator (SOI) layers. Theoretical analysis on the data yields insight into the dependence of thermal properties on film processing conditions. The techniques and data presented here will greatly aid the thermal engineering of interconnects and transistors.
OTHER EDITION IN ANOTHER MEDIUM
International Standard Book Number
9781461373742
PIECE
Title
Springer eBooks
TOPICAL NAME USED AS SUBJECT
Computer engineering.
Engineering.
Mechanics.
Optical materials.
PERSONAL NAME - PRIMARY RESPONSIBILITY
Ju, Y. Sungtaek.
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
Goodson, Kenneth E.
CORPORATE BODY NAME - ALTERNATIVE RESPONSIBILITY
SpringerLink (Online service)
ORIGINATING SOURCE
Date of Transaction
20190307155700.0
ELECTRONIC LOCATION AND ACCESS
Electronic name
مطالعه متن کتاب [Book]
Y
