Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
General Material Designation
[Book]
First Statement of Responsibility
by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Boston, MA :
Name of Publisher, Distributor, etc.
Imprint: Springer,
Date of Publication, Distribution, etc.
2003.
SERIES
Series Title
Springer International Series in Engineering and Computer Science,
Volume Designation
719
ISSN of Series
0893-3405 ;
SUMMARY OR ABSTRACT
Text of Note
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.