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عنوان
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

پدید آورنده
by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.

موضوع
Computer engineering.,Engineering.,Machinery.,Optical materials.

رده

کتابخانه
Center and Library of Islamic Studies in European Languages

محل استقرار
استان: Qom ـ شهر: Qom

Center and Library of Islamic Studies in European Languages

تماس با کتابخانه : 32910706-025

INTERNATIONAL STANDARD BOOK NUMBER

(Number (ISBN
9781461349891
(Number (ISBN
9781461502555

NATIONAL BIBLIOGRAPHY NUMBER

Number
b403103

TITLE AND STATEMENT OF RESPONSIBILITY

Title Proper
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
General Material Designation
[Book]
First Statement of Responsibility
by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.

.PUBLICATION, DISTRIBUTION, ETC

Place of Publication, Distribution, etc.
Boston, MA :
Name of Publisher, Distributor, etc.
Imprint: Springer,
Date of Publication, Distribution, etc.
2003.

SERIES

Series Title
Springer International Series in Engineering and Computer Science,
Volume Designation
719
ISSN of Series
0893-3405 ;

SUMMARY OR ABSTRACT

Text of Note
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

OTHER EDITION IN ANOTHER MEDIUM

International Standard Book Number
9781461349891

PIECE

Title
Springer eBooks

TOPICAL NAME USED AS SUBJECT

Computer engineering.
Engineering.
Machinery.
Optical materials.

PERSONAL NAME - PRIMARY RESPONSIBILITY

Madenci, Erdogan.

PERSONAL NAME - ALTERNATIVE RESPONSIBILITY

Guven, Ibrahim.
Kilic, Bahattin.

CORPORATE BODY NAME - ALTERNATIVE RESPONSIBILITY

SpringerLink (Online service)

ORIGINATING SOURCE

Date of Transaction
20190301081900.0

ELECTRONIC LOCATION AND ACCESS

Electronic name
 مطالعه متن کتاب 

[Book]

Y

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