عنوان
پدید آورنده
موضوع
رده
کتابخانه
محل استقرار
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
9781606505137
Erroneous ISBN
9781606505120
NATIONAL BIBLIOGRAPHY NUMBER
Number
b398662
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
A One-Semester Course in Modeling of VSLI Interconnections
General Material Designation
[Book]
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
1 online resource (362 pages)
CONTENTS NOTE
Text of Note
A One-Semester Course in Modeling of VLSI Interconnections -- Dedication -- Table of Contents -- Preface -- Acknowledgments -- CHAPTER 1: Introductory Concepts -- CHAPTER 2: Modeling of Interconnection Resistances, Capacitances, and Inductances -- CHAPTER 3: Modeling of Interconnection Delays -- CHAPTER 4: Modeling of Interconnection Crosstalk -- CHAPTER 5: Modeling of Electromigration-Induced Interconnection Failure -- CHAPTER 6: Other Interconnection Technologies -- APPENDIX A: Tables of Constants -- APPENDIX B: Method of Images -- APPENDIX C: Method of Moments -- APPENDIX D: Transmission Line Equations -- APPENDIX E: Miller's Theorem -- APPENDIX F: Inverse Laplace Transformation Technique -- Index -- Ad page.
0
SUMMARY OR ABSTRACT
Text of Note
Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.
OTHER EDITION IN ANOTHER MEDIUM
Title
A One-Semester Course in Modeling of VSLI Interconnections
International Standard Book Number
9781606505120
TOPICAL NAME USED AS SUBJECT
Copper Interconnections.
Crosstalk.
Integrated circuits -- Very large scale integration -- Mathematical models.
Integrated circuits.
Interconnections.
Propagation Delays.
VLSI.
PERSONAL NAME - PRIMARY RESPONSIBILITY
Goel, Ashok.
CORPORATE BODY NAME - ALTERNATIVE RESPONSIBILITY
ProQuest (Firm)
ORIGINATING SOURCE
Date of Transaction
20171211105900.0
Cataloguing Rules (Descriptive Conventions))
pn
ELECTRONIC LOCATION AND ACCESS
Electronic name
مطالعه متن کتاب [Book]
Y
