Components, packaging and manufacturing technology :
General Material Designation
[Book]
Other Title Information
selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010 /
First Statement of Responsibility
edited by Yanwen Wu.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Stafa-Zurich, Switzerland :
Name of Publisher, Distributor, etc.
Trans Tech,
Date of Publication, Distribution, etc.
c2011.
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xvi, 852 p. :
Other Physical Details
ill. ;
Dimensions
25 cm.
SERIES
Series Title
Key engineering materials,
Volume Designation
v. 460-461
ISSN of Series
1013-9826 ;
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and indexes.
PARALLEL TITLE PROPER
Parallel Title
ICCPMT 2010
TOPICAL NAME USED AS SUBJECT
Electronic apparatus and appliances, Congresses.
Electronic packaging, Congresses.
Manufacturing processes, Congresses.
Microelectronic packaging, Congresses.
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
Wu, Yanwen.
CORPORATE BODY NAME - PRIMARY RESPONSIBILITY
International Conference on Components, Packaging and Manufacturing Technology(2010 :, Sanya Shi, China)