materials, processes, design, testing and production /
First Statement of Responsibility
by James J. Licari and Leonard R. Enlow.
EDITION STATEMENT
Edition Statement
2nd ed.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Westwood, N.J. :
Name of Publisher, Distributor, etc.
Noyes Publicatons,
Date of Publication, Distribution, etc.
c1998.
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
1 online resource (xxi, 579 p.) :
Other Physical Details
ill.
SERIES
Series Title
Materials science and process technology series.
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index.
CONTENTS NOTE
Text of Note
Introduction -- Substrates -- Thin Film Processes -- Thick Film Processes -- Resistor Trimming -- Parts Selection -- Assembly Processes -- Testing -- Handling and Clean Rooms -- Design Guidelines -- Documentation and Specifications -- Failure Analysis -- Multichip Modules: A New Breed of Hybrid Microcircuits -- References -- Index.
0
SUMMARY OR ABSTRACT
Text of Note
Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present.
SYSTEM REQUIREMENTS NOTE (ELECTRONIC RESOURCES)
Text of Note
Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
ACQUISITION INFORMATION NOTE
Source for Acquisition/Subscription Address
Elsevier Science & Technology
Stock Number
153832:153992
OTHER EDITION IN ANOTHER MEDIUM
Title
Hybrid microcircuit technology handbook.
International Standard Book Number
0815514239
TOPICAL NAME USED AS SUBJECT
Hybrid integrated circuits-- Design and construction, Handbooks, manuals, etc.