CAE/CAD application to electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
American Society of Mechanical Engineers
Date of Publication, Distribution, etc.
1994
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
v, 89 p.: ill.; 28 cm
SERIES
Series Title
EEP
ISSN of Series
vol.9
GENERAL NOTES
Text of Note
Includes bibliographical references and index
TOPICAL NAME USED AS SUBJECT
Entry Element
Congresses ، Heat sinks )Electronics(
Entry Element
Congresses ، Electronic packaging
Entry Element
Congresses ، Heat sinks )Electronics(
Entry Element
Congresses ، Electronic packaging
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK
7870
.
15
.
C33
1994
PERSONAL NAME - PRIMARY RESPONSIBILITY
Relator Code
TI
Entry Element
sponsored by the Electrical and Electronic Packaging Division, ASME; edited by Dereje Agonafer, Robert E. Fulton
AU .D ,refanogA
AU .E treboR ,notluF
CO American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
CO International Mechanical Engineering Congress and Exposition )4991: Chicago, Ill.(
TI Computer-aided design application to electronic packaging