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عنوان
CAE/CAD application to electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

پدید آورنده

موضوع
Congresses ، Heat sinks )Electronics(,Congresses ، Electronic packaging,Congresses ، Heat sinks )Electronics(,Congresses ، Electronic packaging

رده
TK
7870
.
15
.
C33
1994

کتابخانه
Central Library of Sharif University of Technology

محل استقرار
استان: Tehran ـ شهر: Tehran

Central Library of Sharif University of Technology

تماس با کتابخانه : 66005817-021

OTHER STANDARD IDENTIFIER

Standard Number
108079

LANGUAGE OF THE ITEM

.Language of Text, Soundtrack etc
پا‌ییز۹۷
.Language of Text, Soundtrack etc
English

TITLE AND STATEMENT OF RESPONSIBILITY

General Material Designation
)12(
Title Proper
CAE/CAD application to electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

.PUBLICATION, DISTRIBUTION, ETC

Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
American Society of Mechanical Engineers
Date of Publication, Distribution, etc.
1994

PHYSICAL DESCRIPTION

Specific Material Designation and Extent of Item
v, 89 p.: ill.; 28 cm

SERIES

Series Title
EEP
ISSN of Series
vol.9

GENERAL NOTES

Text of Note
Includes bibliographical references and index

TOPICAL NAME USED AS SUBJECT

Entry Element
Congresses ، Heat sinks )Electronics(
Entry Element
Congresses ، Electronic packaging
Entry Element
Congresses ، Heat sinks )Electronics(
Entry Element
Congresses ، Electronic packaging

LIBRARY OF CONGRESS CLASSIFICATION

Class number
TK
7870
.
15
.
C33
1994

PERSONAL NAME - PRIMARY RESPONSIBILITY

Relator Code
TI
Entry Element
sponsored by the Electrical and Electronic Packaging Division, ASME; edited by Dereje Agonafer, Robert E. Fulton

AU .D ,refanogA
AU .E treboR ,notluF
CO American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
CO International Mechanical Engineering Congress and Exposition )4991: Chicago, Ill.(
TI Computer-aided design application to electronic packaging
SE

LOCATION AND CALL NUMBER

Shelving Form of Title, Author, Author/Title
131

Proposal/Bug Report

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