Thermo-mechanical characterization of evolving packaging materials and structures: presented at the 1998 ASME International Mechanical Engineering Congress and Exposition: November 15-20, 1998, Anaheim, California
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
American Society of Mechanical Engineers
Date of Publication, Distribution, etc.
1998
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
v, 141 p.: ill.; 28 cm
SERIES
Series Title
EEP
ISSN of Series
vol.24
GENERAL NOTES
Text of Note
"Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures" --Foreword
Text of Note
Includes bibliographical references and author index
TOPICAL NAME USED AS SUBJECT
Entry Element
Testing ، Electronic packaging
Entry Element
، Electronic packaging-- Materials Fatigue
Entry Element
، Thermal stresses
Entry Element
، Deformation )Mechanics(
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK
7870
.
15
.
T483
1998
PERSONAL NAME - PRIMARY RESPONSIBILITY
Relator Code
TI
Entry Element
sponsored by the Electrical and Electronic Packaging Division, ASME; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh
AU (gnehS) .S ,uiL 1963-
AU gnafgnehZ ,naiQ
AU nip-oahC ,heY
CO American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
CO International Mechanical Engineering Congress and Exposition )8991: Anaheim, Calif.(
CO ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures )8991: Anaheim, Calif.(