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عنوان
CAE/CAD and thermal management issues in electronic systems
پدید آورنده
/ Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
موضوع
Electronic apparatus and appliances - Temmpreture control - Congresses,Electronic packaging - Design - Data processing - Congresses,Heat-Tranmission--Data processing - Congresses,Heat sinks (Electronics) - Congresses,Computer - aided engineering - Congresses
رده
TK
7870
.
25
.
C34
1997
کتابخانه
مكتبات الكلية التقنية 1 بجامعة طهران
محل استقرار
استان:
طهران
ـ شهر:
طهران
تماس با کتابخانه :
66498986
-
021
IR
29702
انگلیسی
IR
CAE/CAD and thermal management issues in electronic systems
[Book]
: presented at the 1997 ASME international mechanical engineering congresses and exposition, November 16-21, 1997, Dallas, Texas
/ Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
New York
: The American Society of Engineers
, 1997
v, 109p.
:ill.
; 28cm
EEP
HTD
; V.23
; V.356
English
Includes bibliographical references and index
Electronic apparatus and appliances - Temmpreture control - Congresses
Electronic packaging - Design - Data processing - Congresses
Heat-Tranmission--Data processing - Congresses
Heat sinks (Electronics) - Congresses
Computer - aided engineering - Congresses
TK
7870
.
25
.
C34
1997
Agonafer, Dereje
The electrical and electronic packaging division, ASME
ایران
University of Tehran. Library of Technical Camp 1
Old cataloging
p
BL
1
Y
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