عنوان
پدید آورنده
موضوع
رده
TK7836 .H366 2010
TK7836
.
H366
2010
کتابخانه
محل استقرار
استان: أذربایجان الشرقیة ـ شهر: تبریز
9780071476232
IR
90-589
انگلیسی
IR
Wire bonding in microelectronics
[Book]
/ George G. Harmon
3rd ed.
New York
: McGraw-Hill,
, c2010.
xx, 426 p.
: ill.
; 24 cm. +, 1 CD-ROM (4 3/4 in.)
Language: انگلیسی
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Print
Wire bonding (Electronic packaging), Production control
Electronic packaging, Reliability
Electronic packaging, Defects
TK7836
.
H366
2010
Harman, George G.
Harman, George G.Reliability and yield problems of wire bonding in microelectronics
ایران
old catalog
p
BL
1
a
Y
