عنوان
پدید آورنده
موضوع
رده
TK 7874 .53 .F7713
TK
7874
.
53
.
F7713
کتابخانه
محل استقرار
eng
Three-dimensional molded interconnect devices )3D-MID( : materials, manufacturing, assembly, and applications for injection molded circuit carriers
Munich
Hanser
2014
xii, 356 pages : color illustrations ; 25 cm
Includes bibliographical references )pages 307-323( and index
Jorg Franke
Raumliche elektronische Baugruppen )3D-MID(.
Design and construction ، Interconnects )Integrated circuit technology(
، Injection molding of plastics
TK
7874
.
53
.
F7713
Franke, Jorg
AU
TI
