Polymeric materials for electronics packaging and interconnection
Washington, DC
American Chemical Society
c1989
xi, 499 p.: ill
ACS symposium series
407
Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988
Includes bibliographical references and indexes
John H. Lupinski, editor, Robert S. Moore, editor
1
1
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، Electronic packaging -- Materials -- Congresses
، Polymers -- Congresses
TK
7870
.
P654
NO
TI
AU Lupinski, John H., 1927-
AU Moore, Robert S., 1933-
AU American Chemical Society. Division of Polymeric Materials: Science and Engineering
AU American Chemical Society. Division of Polymer Chemistry
AU American Chemical Society. Meeting )196th : 1988 : Los Angeles, Calif.(