Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
New York
American Society of Mechanical Engineers
1997
v, 272 p.: ill
EEP ; vol. 21
Includes bibliographies and author index
Microelectronic packaging - Congresses
Fiber optics - Congresses
Structural analysis )Engineering( - Congresses
TK
7874
.
S84527
1997
TI
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir