عنوان
پدید آورنده
موضوع
رده
TK 7870.15 .A852 1996
TK
7870
.
15
.
A852
1996
کتابخانه
محل استقرار
C
Sensing, modeling and simulation in emerging electronic packaging: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition , November 17-22, 1996, Atlanta, Georgia
New York
American Society of Mechanical Engineering
1996
v, 125 p.: ill
FED; Vol. 17
Includes bibliographies and index
Electronic Packaging - Congresses
Multichip modules )Microelectronics( - Congresses
TK
7870
.
15
.
A852
1996
AU
sponsored by the Elctrical and Electronic Packaging Division, ASME ; edited by Chao-Pin Yeh, Charled Ume
ASME International Mechanical Engineering Congress and Exposition )1996: Atlanta, Georgia(
