Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack 95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Luhaina, Maui, Hawaii
New York
American Society of Mechanical Engineers
1995
2 v. : ill
EEP, vol. 10-1,2
Includes bibliographical references and indexes
Electronic packaging - Congresses
TK
7870
.
15
.
I57
1995
AU
Sponsored by the Electrical and Electronic packaging Division, ASME, The Japan Society of Mechanical Engineers; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
International Intersociety Electronic Packaging Conference )1995 : Lahaina, Maui, Hawaii(