عنوان
پدید آورنده
موضوع
رده
TK 7870.15 .A85 1995
TK
7870
.
15
.
A85
1995
کتابخانه
محل استقرار
M1
Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
New York
American Society of Mechanical Engineers
1995
vi, 271 p. : ill
MD ; Vol. 64
Includes bibliographies
Electronic packaging - Materials - Congresses
Materials - Electric properties - Congresses
TK
7870
.
15
.
A85
1995
AU
sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
ASME International Mechanical Engineering Congress and Exposition )1995 : San Francisco, California(
