Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
New York
American Society of Mechanical Engineers
1995
v, 123 p. : ill
EEP ; Vol. 14
Includes bibliographies
Electronic packaging - Congresses
TK
7870
.
15
.
A854
1995
AU
sponsored by the Manufacturing Engineering Division, ASME, The Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
ASME International Mechanical Engineering Congress and Exposition )1995 : San Francisco, California(