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TLpq2409703000
انگلیسی
Experimental Study of Board-level Drop Test for Electronic Devices Using High-speed Camera
[Thesis]
Islam, Md Rashedul
Zhou, Jenny
Lamar University - Beaumont
2019
127
M.E.S.
Lamar University - Beaumont
2019
For the astonishing development of technology and science in present days, the use of mobile devices has been increased an extensive rate. Usually, The handheld electronic devices are made by some electronic components that connect with the Printed Circuit Board (PCB). In the lifetime, these devices undergo different forms of shock or vibration, which causes malfunction or total failure. It is quite common to drop accidentally from hand while using those handheld electronic devices onto the ground. These days for the manufacture companies, it's a big concern for them to reduce the harm due to drop impact. The drop effect onto the mounted components of a handheld device can be appraised and related using the JEDEC board-level drop test technique. In this study, experimental drop-test has been carried out to determine the drop impact of PCB's on different points and various drop surfaces and the results are analysed and compared. A high-speed camera is used to perform the experiment. PCB mounted on a drop table is dropped from a certain height and the vibration generated on the PCB captured using the high-speed camera. Later on, the images are analysed by a motion tracker and analyser software named Movias Pro. Parallelly, a Simulink model is built and the experimental results are compared to the closed-form analytical solutions.
Mechanical engineering
Islam, Md Rashedul
Zhou, Jenny
مطالعه متن کتاب p
[Thesis]
276903
a
Y
