عنوان
پدید آورنده
موضوع
رده
TK7870.15 .S787 2014eb
TK7870
.
15
.
S787
2014eb
کتابخانه
محل استقرار
1523117427
1608076970
1608076989
9781523117420
9781608076970
9781608076987
9781608076970
Microwave and millimeter-wave electronic packaging /
[Book]
Rick Sturdivant.
London [England] :
Artech House,
2014.
©2014
1 online resource (281 pages) :
illustrations
Artech House Microwave Library
Includes bibliographical references at the end of each chapters and index.
Introduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons.
0
Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --
Microwave and millimeter-wave electronic packaging.
9781608076970
Microelectronic packaging.
Microelectronic packaging.
TECHNOLOGY & ENGINEERING-- Mechanical.
TEC-- 009070
621
.
381046
23
TK7870
.
15
.
S787
2014eb
Sturdivant, Rick
20200823045553.0
pn
مطالعه متن کتاب [Book]
Y
