Includes bibliographical references (pages 291-314) and index.
Ch. 1. Overview of High Temperature Electronics -- Ch. 2. Selection and Use of Silicon Device at High Temperatures -- Ch. 3. Wide Bandgap Semiconductors -- Ch. 4. Passive Device Selection and Use at High Temperature -- Ch. 5. First-level Packaging Considerations for the Use of Electronic Hardware at High Temperatures -- Ch. 6. Second and Third Level Packaging Considerations for the Use of Electronic Hardware at High Temperatures -- Ch. 7. Thermal Management for High Temperature Electronics -- Ch. 8. Applications -- Ch. 9. Accelerated Testing of Elevated Temperature Electronics.
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Electronic apparatus and appliances-- Thermal properties.
Electronic packaging.
Heat resistant materials.
Electronic packaging.
Heat resistant materials.
Electronic apparatus and appliances-- Thermal properties.