عنوان
پدید آورنده
موضوع
رده
کتابخانه
محل استقرار
TL48975
انگلیسی
Integrity Issues & Simulation of Microelectronic Power Distribution Network
[Thesis]
Sharmin Islam
Elshabini, Aicha
University of Idaho
2016
121
Committee members: Barlow, Fred; Guizani, Mohsen; Li, Feng
Place of publication: United States, Ann Arbor; ISBN=978-1-369-04368-6
M.S.
Electrical and Computer Engineering
University of Idaho
2016
High speed, high densities and system-in-packages play an important role in microelectronics. Taking advantage of process technology improvements, semiconductor vendors are increasing device densities which increases demand on total current delivery. In this case, electrical integrity which includes signal integrity, power integrity and electromagnetic interference, is a major issue. Signal integrity assures acceptable quality of signals within the system, such as transmission line effects, cross talk, impedance mismatch. Power integrity assures acceptable quality of power delivery within the system, such as voltage drop, high impedance, parasitic via inductances, noise coupling are the most significant challenges for a semiconductor device designer. The increasingly rigorous noise requirements and timing issues require more predictive signal integrity and power integrity analysis to meet the market demand.
Electrical engineering
Applied sciences;Ansys HFSS;Differential S parameters;Power distribution network (PDN);Power integrity;Signal integrity;Z parameters
Ferreira, Silvia C.
Elshabini, Aicha
Electrical and Computer Engineering
University of Idaho
1831570254; 10149250
مطالعه متن کتاب p
[Thesis]
276903
a
Y
