Effect of pad location relative to glass weave on cratering and underfill process improvement and material evaluation
[Thesis]
Mohammad M. Quran
Borgesen, Peter
State University of New York at Binghamton
2014
94
Committee members: Chou, Chun-An; Greene, Christopher M.
Place of publication: United States, Ann Arbor; ISBN=978-1-321-57220-9
M.S.
Systems Science Industrial Engineering
State University of New York at Binghamton
2014
This research contains two studies. First study investigated one of the factors that affect the performance of pads; the locations of pads relative to glass weave. Dage 4000plus bond tester was used in conducting a joint-level testing of pads on 370HR printed circuit board that has 1080 glass fabric. Scanning acoustic microscopy (SAM) was utilized to image pads with respect to upper layer of glass weave. It was found that locations of pads do not affect their strength, but it has a weak effect on fatigue performance.
Industrial engineering; Systems science; Materials science