Handbook Of Electronics Packaging Design and Engineering
[Book]
by Bernard S. Matisoff.
Second edition
Dordrecht
Springer Netherlands
1990
(volumes)
1 Electronics Packaging Design and Engineering --;2 Project Planning --;3 Human Factors Engineering --;4 Fabrication Processes --;5 Mechanical Fasteners --;6 Heat Transfer and Thermal Control --;7 Shock and Vibration Design --;8 Subassemblies and Assemblies --;9 Design Considerations for Space Electronics --;10 Material Plating and Finishes --;11 Radio Frequency and Electromagnetic Shielding --;12 Design and Development of Miniature Electronics Systems --;13 Wire and Cabling --;14 Materials and Processes --;15 Safety --;16 Printed Circuits --;17 Electrical Interconnection Systems --;18 Forced Air Cooling Systems --;19 Preferred Materials for Electronic Packaging --;20 Selection of Plastics for Various Environments --;21 Mechanics of Simple Stresses --;22 Formulas and Conversions --;23 Design Reviews --;An Instrument for Decision Making --;24 Slide Mount Considerations for Electronic Assemblies --;25 Reference Designations for Electrical and Electronic Parts and Equipment --;26 Metal Alloy and Temper Designation Systems --;Appendix A --;Appendix B.
The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design of electronics equip- ment. The judicious use of uniform design practices will realize the following economies and equipment improvements: * Economics of design.