عنوان
پدید آورنده
موضوع
رده
TK7870.17 S553 2015
TK7870
.
17
S553
2015
کتابخانه
محل استقرار
149391555X
1493915568
9781493915552
9781493915569
b540898
Wafer-level chip-scale packaging :
[Book]
analog and power semiconductor applications
Shichun Qu, Yong Liu.
New York
Springer
[2015]
xvii, 322 pages : illustrations ; 24 cm
Chapter 1. Demand and challenges for wafer level chip-scale analog and power packaging --;Chapter 2. Fan-in wafer-level chip scale package --;Chapter 3. Fan-out wafer-level chip scale package --;Chapter 4. Stackable wafer level chip scale package --;Chapter 5. Wafer-level discrete power Mosfet package design --;Chapter 6. Wafer-level packaging TSV/Stack die for integration of analog and power solution --;Chapter 7. Thermal management, design, analysis for WLCSP --;Chapter 8. Electrical and multi-physics simulation for aAnalog and pPower WLCSP --;Chapter 9. WLCSP assembly --;Chapter 10. WLCSP typical reliability and test.
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
Chip scale packaging.
TK7870
.
17
S553
2015
Shichun Qu, Yong Liu.
Shichun Qu
Yong Liu
مطالعه متن کتاب [Book]
Y
