Preface"; "Contributors"; "Table of Contents"; "1 INTRODUCTION"; "2 SILICIDES AND CONTACTS FOR ULSI"; "3 ALUMINUM BASED MULTILEVEL METALLIZATIONS IN VLSI/ULSICs"; "4 INORGANIC DIELECTRICS"; "5 ORGANIC DIELECTRICS IN MULTILEVEL METALLIZATION OF INTEGRATED CIRCUITS"; "6 PLANARIZATION TECHNIQUES"; "7 LITHOGRAPHY AND ETCH ISSUES FOR A MULTILEVEL METALLIZATION SYSTEM"; "8 ELECTRO- AND STRESS MIGRATION IN MLM INTERCONNECT STRUCTURES"; "9 MULTILEVEL METALLIZATION TEST VEHICLE"; "10 MANUFACTURING AND ANALYTIC METHODS" "11 characterization techniques for vlsi multilevel metallization""12 electronic packaging and its influences on integrated circuit design and processing"; "13 future interconnect systems"; "index"
Covers various aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. This book also covers substrate characterization, adhesion, cleaning and processing.
Physical vapor deposition -- Handbooks, manuals, etc.