عنوان
پدید آورنده
موضوع
رده
کتابخانه
محل استقرار
0470827807
9780470827802
dltt
Modeling and simulation for microelectronic packaging assembly
[Book]
manufacturing, reliability, and testing /
Sheng Liu, Yong Liu.
Singapore :
Wiley,
2011.
Includes bibliographical references and index.
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Microelectronic packaging-- Simulation methods.
TEC008010
bisacsh
Liu, S., (Sheng),1963-
Liu, Yong, (Micro-optoelectronic mechanical systems professor)
Wiley Online Library (Online service)
20190423142947.0
مطالعه متن کتاب [Book]
Y
