Failure Modes and Mechanisms in Electronic Packages
[Book]
by Puligandla Viswanadham, Pratap Singh.
Boston, MA :
Imprint: Springer,
1998.
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.