Components, packaging and manufacturing technology :
[Book]
selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010 /
edited by Yanwen Wu.
Stafa-Zurich, Switzerland :
Trans Tech,
c2011.
xvi, 852 p. :
ill. ;
25 cm.
Key engineering materials,
v. 460-461
1013-9826 ;
Includes bibliographical references and indexes.
ICCPMT 2010
Electronic apparatus and appliances, Congresses.
Electronic packaging, Congresses.
Manufacturing processes, Congresses.
Microelectronic packaging, Congresses.
Wu, Yanwen.
International Conference on Components, Packaging and Manufacturing Technology(2010 :, Sanya Shi, China)