عنوان
پدید آورنده
موضوع
رده
کتابخانه
محل استقرار
0791814270
0791814424
0791814491
b397636
Mechanics and materials for electronic packaging :
[Book]
presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
co-sponsored by the Applied Mechanics Division, ASME ... [et al.].
New York, N.Y. :
American Society of Mechanical Engineers,
c1994.
3 v. :
ill. ;
28 cm.
AMD ;
vol. 187, 193, 195
Includes bibliographical references and index.
v. 1. Design and process issues in electronic packaging / edited by William T. Chen, Luu T. Nguyen, Walter L. Winterbottom -- v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir -- v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.
0
Electronic packaging-- Congresses.
Chen, William T.
Dunn, M. L., (Martin L)
Schen, Michael A.
American Society of Mechanical Engineers., Applied Mechanics Division.
International Mechanical Engineering Congress and Exposition(1994 :, Chicago, Ill.)
19950316000000.0
مطالعه متن کتاب [Book]
Y
