Materials science and process technology series. Electronic materials and process technology.
Includes bibliographical references and index.
Issues and Trends Affecting Lithography Tool Selection Strategy -- Resist Technology: Design, Processing and Applications -- Lithography Process Monitoring and Defect Detection -- Techniques and Tools for Photo Metrology -- Techniques and Tools for Optical Lithography -- Microlithography Tool Automation -- Electron Beam ULSI Applications -- Rational Vibration and Structural Dynamics for Lithographic Tool Installations -- Applications of Ion Microbeam Lithography and Direct Processing -- X-Ray Lithography.
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This handbook gives readers a look at the technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings - including optical lithography, electron beam, ion beam, and X-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge, and pattern feature dimension control. The book's explanation of resist and resist process equipment technology describes the relationship between the resist process and equipment parameters. The basics of resist technology are also covered - including an entire chapter on resist process defectivity and the potential yield limiting effect on device production.
Elsevier Science & Technology
153814:153974
Handbook of VLSI microlithography.
0815514441
Integrated circuits-- Very large scale integration.