Polymeric materials for electronics packaging and interconnection
Washington, DC
American Chemical Society
1989
xi, 499 p. : ill. ; 24 cm
ACS symposium series, 704
Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, Calif
Includes bibliographical references
John H. Lupinski, editor, Robert S. Moore, editor
Materials -- Congresses ، Electronic packaging
Congresses ، Polymers
TK
7870
.
P654
1989
TI
AU H nhoJ ,iksnipuL 1927-
AU S treboR ,erooM 1933-
CO American Chemical Society, Division of Polymeric Materials
CO American Chemical Society, Division of Polymer Chemistry
CO American Chemical Society, Meeting, )691th, 8891, Los Angeles, Calif.(