عنوان
پدید آورنده
موضوع
رده
TK 7870 .15 .C33 1994
TK
7870
.
15
.
C33
1994
کتابخانه
محل استقرار
108079
پاییز۹۷
English
)12(
CAE/CAD application to electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
New York
American Society of Mechanical Engineers
1994
v, 89 p.: ill.; 28 cm
EEP
vol.9
Includes bibliographical references and index
Congresses ، Heat sinks )Electronics(
Congresses ، Electronic packaging
Congresses ، Heat sinks )Electronics(
Congresses ، Electronic packaging
TK
7870
.
15
.
C33
1994
TI
sponsored by the Electrical and Electronic Packaging Division, ASME; edited by Dereje Agonafer, Robert E. Fulton
AU .D ,refanogA
AU .E treboR ,notluF
CO American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
CO International Mechanical Engineering Congress and Exposition )4991: Chicago, Ill.(
TI Computer-aided design application to electronic packaging
SE
131
