عنوان
پدید آورنده
موضوع
رده
TK 7870 .15 .T483 1998
TK
7870
.
15
.
T483
1998
کتابخانه
محل استقرار
122025
پاییز۹۷
English
)70(
Thermo-mechanical characterization of evolving packaging materials and structures: presented at the 1998 ASME International Mechanical Engineering Congress and Exposition: November 15-20, 1998, Anaheim, California
New York
American Society of Mechanical Engineers
1998
v, 141 p.: ill.; 28 cm
EEP
vol.24
"Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures" --Foreword
Includes bibliographical references and author index
Testing ، Electronic packaging
، Electronic packaging-- Materials Fatigue
، Thermal stresses
، Deformation )Mechanics(
TK
7870
.
15
.
T483
1998
TI
sponsored by the Electrical and Electronic Packaging Division, ASME; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh
AU (gnehS) .S ,uiL 1963-
AU gnafgnehZ ,naiQ
AU nip-oahC ,heY
CO American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
CO International Mechanical Engineering Congress and Exposition )8991: Anaheim, Calif.(
CO ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures )8991: Anaheim, Calif.(
SE
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